JPH0113421Y2 - - Google Patents
Info
- Publication number
- JPH0113421Y2 JPH0113421Y2 JP17784184U JP17784184U JPH0113421Y2 JP H0113421 Y2 JPH0113421 Y2 JP H0113421Y2 JP 17784184 U JP17784184 U JP 17784184U JP 17784184 U JP17784184 U JP 17784184U JP H0113421 Y2 JPH0113421 Y2 JP H0113421Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- ejector
- fixed
- movable
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17784184U JPH0113421Y2 (en]) | 1984-11-22 | 1984-11-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17784184U JPH0113421Y2 (en]) | 1984-11-22 | 1984-11-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6192056U JPS6192056U (en]) | 1986-06-14 |
JPH0113421Y2 true JPH0113421Y2 (en]) | 1989-04-19 |
Family
ID=30735414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17784184U Expired JPH0113421Y2 (en]) | 1984-11-22 | 1984-11-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0113421Y2 (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0747292B2 (ja) * | 1986-06-28 | 1995-05-24 | 三菱マテリアル株式会社 | トランスフア−成形用金型 |
JP2676231B2 (ja) * | 1988-09-07 | 1997-11-12 | 三菱電機株式会社 | 半導体装置の樹脂封止装置 |
-
1984
- 1984-11-22 JP JP17784184U patent/JPH0113421Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6192056U (en]) | 1986-06-14 |
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